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A Novel Structure of Bondwire and Microstrip Lines for Chip-to-Chip Inter-Connection Up to 130GHz

  • Source: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2020 IEEE Electrical Design of. :1-3 Dec, 2020

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Data Augmentation for Retrieval- and Generation-Based Dialog Systems

  • Source: 2020 IEEE 6th International Conference on Computer and Communications (ICCC) Computer and Communications (ICCC), 2020 IEEE 6th International Conference on. :1716-1720 Dec, 2020

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A Video Based Method of Occlusion Vehicle Completion

  • Source: 2020 IEEE 6th International Conference on Computer and Communications (ICCC) Computer and Communications (ICCC), 2020 IEEE 6th International Conference on. :1368-1372 Dec, 2020

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  • 1-10 of  23,881 results for ""Chen, Chen""